nichia sts - da1 - 3848 nichia corporation specifications for blue led ncsc219bt - v1 pb built rohs compliant
nichia sts - da1 - 3848 1 specifications (1) absolute maximum ratings item sy mbol absolute maximum rating unit forward current i f 1500 ma pulse forward current i fp 2000 ma allowable reverse current i r 85 ma power dissipation p d 4.95 w operating temperature t opr - 40~100 c storage temperature t stg - 40~100 c junction temperat ure t j 150 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =350ma 2.93 - v radiant flux e i f =350ma 680 - mw chromaticity coordinate x - i f =350ma 0.161 - - y - i f =350ma 0.026 - - thermal resistance r js - 8 11 c/w * characteristics at t s =25c. * radiant flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junctio n to t s measuring point.
nichia sts - da1 - 3848 2 ranks item rank min max unit forward voltage m1 3.1 3.3 v l2 2.9 3.1 l1 2.7 2.9 radiant flux p18d21 700 750 mw p17d22 650 700 p17d21 600 650 color ranks rank v1 rank v2 x 0.1611 0.1566 0.1658 0.1695 x 0.1566 0.1510 0.1610 0.1658 y 0.0138 0.0177 0.0341 0.0294 y 0.0177 0.0230 0.0400 0.0341 * ranking at t s =25c. * forward voltage tolerance: 0.05v * radiant flux tolerance: 7% * chromaticity coordinate tolerance: 0.01 * leds from the above ranks will be shipped. the rank combination ratio per shipment will be decided by nichia. radiant flux ranks by color rank ranking by radiant flux ranking by color coordinates p17d21 p17d22 p18d21 v1 v2
nichia sts - da1 - 3848 3 chromaticity diagram 440 450 455 460 465 470 475 480 v1 v2 0.00 0.05 0.10 0.15 0.20 0.00 0.05 0.10 0.15 0.20 y x
nichia sts - da1 - 3848 4 outline dimensions k a o p r o t e c t i o n d e v i c e ` d i e h e a t s i n k s t s - d a 7 - 7 9 1 5 n c s x 2 1 9 b - v 1 n o . ( g u n i t : m m ) t h i s p r o d u c t c o m p l i e s w i t h r o h s d i r e c t i v e . u ? r o h s ? m * ( g u n i t : m m , t o l e r a n c e : 0 . 2 ) ? i t e m ` | p a c k a g e m a t e r i a l s ? ? | e n c a p s u l a t i n g r e s i n m a t e r i a l s O | e l e c t r o d e s m a t e r i a l s | l e n s m a t e r i a l s | w e i g h t d e s c r i p t i o n c e r a m i c s ` ? s i l i c o n e r e s i n a u - p l a t e d ` ? s i l i c o n e r e s i n 0 . 0 3 0 g ( t y p ) ` | d i e h e a t s i n k m a t e r i a l s a u - p l a t e d 2 0 . 4 3 . 5 c a t h o d e m a r k 3 . 5 2 . 9 a n o d e c a t h o d e 1 . 3 0 . 5 3 . 2 0 . 4 5 2 . 4 3 . 2 d i e h e a t s i n k `
nichia sts - da1 - 3848 5 s oldering ? recommended reflow soldering condition(lead recommended soldering pad pattern * this led is designed to be reflow soldered on to a pcb. if dip soldered or hand soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. * avoid rapid cooling . ramp down the temperature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip - outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability. when using automatic pick and place machine, use a pick up nozzle which doe s not directly apply stress to the encapsulation of the leds. recommended conditions: using a nozzle designed for the leds is recommended. (see figure below) * the nozzle must not have any direct contact with the encapsulating resin. direct contact with the encapsulating resin may result in internal disconnections causing the led not to illuminate. 120sec m ax pre - heat 180 to 200 c 260c m ax 10sec m ax 60sec m ax above 220c 1 to 5c per sec ( g u n i t : m m ) 0 . 5 0 . 4 0 . 5 3 . 3 4 . 1 1 . 2 1 . 3 ( g u n i t : m m ) 0 . 5 a e x p a n s i o n o f a 0 . 1 5 1 . 9 4 . 5 0 . 4 a 3 . 5
nichia sts - da1 - 3848 6 * repairing should not be done after the leds have been soldered. when repairing is unavoidable, a hot plate should be used. it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. * the die heat sink should be soldered to customer pcb. if it is difficult or impossible, use high heat - dissipating adhesive. * when soldering, do not apply stress to the led while the led is hot. * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is required, such as high - density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * when flux is used, it should be a halogen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sur e that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a normal visual inspection. when using t he product, ensure that there are no issues with the soldering conditions.
nichia sts - da1 - 3848 7 tape and reel dimensions ` / ` t r a i l e r a n d l e a d e r ` ` e m b o s s e d c a r r i e r t a p e ` t o p c o v e r t a p e f e e d d i r e c t i o n ` 4 0 0 m m l e a d e r w i t h o u t t o p c o v e r t a p e 4 0 0 m m m i n ` 1 6 0 m m t r a i l e r 1 6 0 m m m i n ( e m p t y p o c k e t s ) l e d ? l o a d e d p o c k e t s 1 0 0 m m l e a d e r w i t h t o p c o v e r t a p e 1 0 0 m m m i n ( e m p t y p o c k e t ) n x x x 2 1 9 x s t s - d a 7 - 1 7 2 8 b ` t a p e 1 . 7 5 0 . 1 8 0 . 1 2 0 . 0 5 4 0 . 1 5 . 5 0 . 0 5 - 0 1 . 5 + 0 . 1 1 2 + 0 . 3 - 0 . 1 ( g u n i t : m m ) n o . 1 . 5 + 0 . 2 - 0 c a t h o d e m a r k r e e l s i z e : 3 5 0 0 p c s 1 ` 3 5 0 0 t h e t a p e p a c k i n g m e t h o d c o m p l i e s w i t h j i s c 0 8 0 6 ( p a c k a g i n g o f e l e c t r o n i c c o m p o n e n t s o n c o n t i n u o u s t a p e s ) . * j i s c 0 8 0 6 ? ` * g ? I ` ` ? ` ( 1 0 n ) l e d ` ` N w h e n t h e t a p e i s r e w o u n d d u e t o w o r k i n t e r r u p t i o n s , n o m o r e t h a n 1 0 n s h o u l d b e a p p l i e d t o t h e e m b o s s e d c a r r i e r t a p e . t h e l e d s m a y s t i c k t o t h e t o p c o v e r t a p e . * 3 . 7 0 . 1 0 . 3 5 0 . 0 5 2 . 2 5 0 . 1 3 . 7 0 . 1 ` r e e l 1 3 0 . 2 3 3 0 2 l a b e l 2 1 0 . 8 1 7 . 5 1 1 0 0 1 1 3 . 5 1
nichia sts - da1 - 3848 8 packaging - tape & reel n i c h i a l e d s t s - d a 7 - 4 9 8 9 n x x x x x x x l a b e l l a b e l n o . r e e l ` ` s e a l m o i s t u r e - p r o o f b a g ? r o h s n x x x x x x x x x x x l e d * * * * * * * n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n t y p e l o t q t y . y m x x x x - r r r p c s r o h s n x x x x x x x x x x x l e d * * * * * * * r r r p c s t y p e r a n k q t y . n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n r e e l s a r e s h i p p e d w i t h d e s i c c a n t s i n h e a t - s e a l e d m o i s t u r e - p r o o f b a g s . ` ? ` d e s i c c a n t s m o i s t u r e - p r o o f b a g s a r e p a c k e d i n c a r d b o a r d b o x e s w i t h c o r r u g a t e d p a r t i t i o n s . ? K ` ` ? y ? ? * ? \ H y ? B ? y * ? Q H n u ? p ? ? * u s i n g t h e o r i g i n a l p a c k a g e m a t e r i a l o r e q u i v a l e n t i n t r a n s i t i s r e c o m m e n d e d . d o n o t e x p o s e t o w a t e r . t h e b o x i s n o t w a t e r - r e s i s t a n t . d o n o t d r o p o r e x p o s e t h e b o x t o e x t e r n a l f o r c e s a s i t m a y d a m a g e t h e p r o d u c t s . p r o d u c t s s h i p p e d o n t a p e a n d r e e l a r e p a c k e d i n a m o i s t u r e - p r o o f b a g . t h e y a r e s h i p p e d i n c a r d b o a r d b o x e s t o p r o t e c t t h e m f r o m e x t e r n a l f o r c e s d u r i n g t r a n s p o r t a t i o n . * u ? ` ? n o ` y i f n o t p r o v i d e d , i t w i l l n o t b e i n d i c a t e d o n t h e l a b e l . * * * * * * * i s t h e c u s t o m e r p a r t n u m b e r . O * * * * * * * * ? f o r d e t a i l s , s e e " l o t n u m b e r i n g c o d e " i n t h i s d o c u m e n t . * ? t h e l a b e l d o e s n o t h a v e t h e r a n k f i e l d f o r u n - r a n k e d p r o d u c t s . * ?
nichia sts - da1 - 3848 9 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2014 e 2015 f 2016 g 2017 h 2018 i 2019 j m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - nichia's product number rrr - ranking by color coordinates, ranking by radiant flux, ranking by forwa rd voltage
nichia sts - da1 - 3848 10 derating characteristics NCSC219B-V1 ? no. sts-da7-7924 0 500 1000 1500 2000 0 20 40 60 80 100 120 derating1 (57, 1500) (10, 1500) (100, 803) (100, 535) (100, 401) (0, 1200) 0 500 1000 1500 2000 0 20 40 60 80 100 120 derating2 (99, 1500) (100, 1450) 100 1000 10000 1 10 100 duty 1500 2000 S allowable forward current(ma) ???? ( `? ) - S solder temperature(cathode side) vs allowable forward current ?? - S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ???? ( `? ) solder temperature(cathode side)( c) ?? ambient temperature( c) ?`?` duty ratio(%) ?`?` - S duty ratio vs allowable forward current t a =25 c 20 c/w 30 c/w 40 c/w ja r = ja r = ja r =
nichia sts - da1 - 3848 11 optical characteristics NCSC219B-V1 ? no. sts-da7-7925 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 spectrum ? relative radiant intensity(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 350ma i fp = t a =25 c 350ma i fp = t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3848 12 forward current characteristics / temperature characteristics NCSC219B-V1 ? no. sts-da7-7926 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 10000 2.0 2.5 3.0 3.5 4.0 vfif 350 2000 relative radiant flux(a.u.) ?? - ambient temperature vs relative radiant flux forward current(ma) 0 1 2 3 4 5 0 500 1000 1500 2000 2500 ifiv relative radiant flux(a.u.) - forward current vs relative radiant flux forward current(ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) * ??? all characteristics shown are for reference only and are not guaranteed. =25 c t a i fp = 350ma i fp = 350ma t a =25 c
nichia sts - da1 - 3848 13 forward current characteristics / temperature characteristics NCSC219B-V1 ? no. sts-da7-7927 444 446 448 450 452 454 456 10 100 1000 10000 if d 444 446 448 450 452 454 456 -60 -40 -20 0 20 40 60 80 100 120 ta d 350ma i fp = - L forward current vs dominant wavelength forward current(ma) ?? - L ambient temperature vs dominant wavelength dominant wavelength(nm) L dominant wavelength(nm) L ?? ambient temperature( c) 0.00 0.01 0.02 0.03 0.04 0.05 0.14 0.15 0.16 0.17 0.18 0.19 ifxy 20ma(453.0nm) 100ma(452.0nm) 350ma(450.2nm) 1500ma(447.4nm) 2000ma(446.9nm) x y - ? ( L ) forward current vs chromaticity coordinate(d) t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25 c
nichia sts - da1 - 3848 14 reliability (1) tests and results test reference stand ard test conditions test duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed - 4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed - 4701 303 303a t sld =2455c, 5sec, lead - free solder(sn - 3.0ag - 0.5cu) #2 0/22 temperature cycle jeita ed - 4701 100 105 - 40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/22 moisture resistance (cyclic) jeita ed - 4701 200 203 25c~65c~ - 10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed - 4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed - 4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed - 4701 200 202 t a = - 40c 1000hours #1 0/22 room temperature operating life t a =25c, i f =900ma test board: see notes below 1000hours #1 0/22 high temperature operating life t a =100c, i f =350ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60 c, rh=90%, i f =650ma test board: see notes below 500hours #1 0/22 low temperature operating life t a = - 40c, i f =350ma test board: see notes below 1000hours #1 0/22 vibration jeita ed - 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minut es #1 0/10 electrostatic discharges jeita ed - 4701 300 304 hbm, 2kv, 1.5k, 100pf, 3pulses, alternately positive or negative #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 40c/w 2) measurements are performed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria #1 forward voltage(v f ) i f =350ma >initial value1.1 radiant flux( e ) i f =350ma nichia sts - da1 - 3848 15 cautions (1) storage conditions temperature humidity time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std - 020 for moisture - sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical perform ance degradation. products are packed in moisture - proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the mois ture - proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferably the origin al moisture - proof bags for storage. after the period after opening storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. although the leads or electrode pads ( anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish, and thus leading to difficulties in soldering. if unused leds remain, they mus t be stored in a hermetically sealed container. nichia recommends using the original moisture - proof bag for storage. do not use sulfur - containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur. t he contaminated plating of leds might cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molec ular weight volatile siloxane. to prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended. if the leds are operated with constant voltage using circuit a, the current through the leds may vary due to the variation in forward voltage characteristics of the leds. this product should be oper ated using forward current. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize the led characteris tics. en sure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. ( a ) . . . ( b ) . . .
nichia sts - da1 - 3848 16 (3) handling precautions do not handle the leds with bare hands a s it will contaminate the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the bump to break, which will cause the led not to illuminate. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, chipped, delaminate or deformed, causing bump - bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comp ly can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause bump to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products onto a pcb can cause the p ackage to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerted on the leds placed near the score lin es. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. if an aluminum pcb is used, customer is advised to verify the pcb with the products before use . thermal stress during use can cause the solder joints to crack. volatile organic compounds that have been released from materials present around the leds (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin. if the leds are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and it may greatly reduce the led light output and/or cause a color shift. in this case, ventilating the environment may improve the reduction in light output and/or color shift. perform a light - up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the followi ng measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive mat erials ensure that tools, jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generatio n with moisture neutralizing the charge with ionizers the customer is advised to check if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward volta ge measurement or a light - up test at low current (1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma
nichia sts - da1 - 3848 17 (6) thermal management proper thermal management is an important when designing products with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w (7) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. other solvents may cause premature failure to the leds due to the d amage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds, soak a cloth with isopropyl alcohol (ipa), then squ eeze it before wiping the leds. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make s ure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other han d, the iec 60825 - 1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825 - 1:20112001, which still includes leds in it s scope. most of nichia's leds can be classified as belonging into either the exempt group or risk group 1. high - power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewin g directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measuremen t instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly je opardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disass embling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of this product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins. t s p o i n t
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